
David Laforet
Etch and Lithography Process Engineer

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About me
Lead Principal Technology Development
Education

Université Claude Bernard Lyon 1
1988 - 1994Master of Science Integrated Electronic Devices
Experience

Atmel Corporation, France
Mar 1996 - Jun 2001Etch and Lithography Process Engineer-Lithography process engineer: 248nm lithography-Etch process engineer: dry clean, wet etch & dry poly etch

Infineon Technologies, USA
Jul 2001 - Jul 2005Senior Lithography Process Engineer-Lithography process engineer - 193nm lithography

Qimonda, Germany
Aug 2005 - Jul 2009Senior Technology Development Engineer-Responsible for the development of DRAM technology modules

Infineon Technologies, Austria
Nov 2009 - now-Responsible for the feasibility study of next generation technology concepts-Responsible for the development and project management of new technologies from project definition to production release -Responsible for the transfer of Power MOSFET products between fabs (International Rectifier)
Lead Principal Technology Development
Apr 2011 - nowProduct Transfer Engineer
Nov 2009 - Mar 2011
Licenses & Certifications

Business studies
Stonebridge Associated CollegesSept 2008
Project Management
Stonebridge Associated CollegesAug 2008
IPMA Project Manager Level C
IPMA: International Project Management AssociationMar 2016
Languages
- enEnglish
- geGerman
- frFrench
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