Experience

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  Madmonkeyz climbing gym sdn bhd

  Sept 2009 - Oct 2013

  Rock climbing instructor

  To share and teach the art of climbing to people who are new in this sport and also to help those are already in to improve to be a better climber.

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  Soft device sdn bhd

  Sept 2010 - Dec 2010

  Internship (test engineer)

  Product testing, and troubleshooting of faulty device.

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  Uce international group

  Jan 2013 - Apr 2013

  Drive test engineer

  To verify all working antenna around Klang valley, making sure that it is in a good working condition and supplying to the market demands in terms of speed connectivity and speech quality.

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  Freescale semiconductor

  Aug 2013 - Jan 2014

  Manufacturing supervisor

  Manage people and plan operations of machines, to meet targeted production per week. And to work with equipment and process department to meet targeted output with the best quality with the goal of zero defect

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  Nxp semiconductors

  Jan 2014 - now

  Present: Overall quality driver in BGA and Leaded FE (Incoming die prep to Wirebond ). Includes, process improvement, zero defect quality mindset, cost saving projects, project management. Drive quality habit and culture / quality improvement collaboration with operation team to meet department and plant quality goal. Material disposition review and dispositionWorked as dept auditee leader for all IATF,GMA,VDA, & all customer audits.Conducted micro level assessments on Dept SWE, Control plan, FMEA. Bridge for total NXP Sites for BGA & Leaded ASSY on quality lesson learned. Certified IATF 16949:2016 Lead auditor training for 1st & 2nd party auditor (SMMT/NCM/KL/1803003) Show less 1. In Charge of wafer sawing process, includes (Die preparation, wafer mounting, barcode label, Laser grooving,wafer sawing, wafer UV) 2. Machine knowledge ( Disco Saw 600 series and 6000 series, disco laser 7160, Lintec wafer mounter and wafer UV)3. In Charge of all incoming quality for visual mechanical damage on wafer, and also any defect that is related to die level.4. Problem solving Skill set in Ford 8D methodology, the Failure mode effect analysis (FMEA), DMAIC methodology from 6 sigma probelm solving tool. 5. Constant project improvement using Toyota Kaizen method. 6. BEM registered engineer (Major Electronic) Show less

  • NPI & Project Process Engineer

    Jan 2020 - now

  • Operation Quality Driver

    Jan 2017 - Jan 2020

  • Saw Process Engineer

    Jan 2014 - Jan 2017