Experience

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  Rensselaer polytechnic institute

  Aug 2018 - Dec 2019

  • Held interactive group sessions by helping students review important class concepts• Explained Chinese phonetics, pragmatics, and grammar structure in an authentic and effective way • Performed morphology-controlled growth of semiconducting 2D materials for applications in optoelectronics• Participated in characterizing 2D materials research, mainly using Photoluminescence spectroscopy to collect information about bandgap and electronic structure• Utilized information from Raman Spectroscopy to identify different vibrational modes in materials Course: Introduction to Biology & Organic Chemistry II• Walked students through the problem-solving process with the focus on understanding of course material and application of useful techniques Course: Introduction to Engineering Analysis(IEA)• Assisted 60+ students with problem sets by reviewing important engineering concepts and topics Course: Physics II• Assisted 20+ students in physics laboratory to review important examples from class and provided instructions on hands-on experiments• Attended weekly staff meeting to share common questions raised during the lab session • Graded exams and problem sets submitted by students

  • Chinese Mentor

    Sept 2019 - Dec 2019

  • Research Assistant

    Jan 2019 - Dec 2019

  • Advising & Learning Assistance Center(ALAC) Tutor

    May 2019 - Aug 2019

  • Mentor

    Jan 2019 - May 2019

  • Lab Facilitator

    Aug 2018 - Dec 2018
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  Emerson

  Jan 2020 - May 2020

  Chemistry co-op

  • Analyzed incoming oil samples by performing fundamental laboratory tests such as moisture, Total Acid Number (TAN), viscosity and FTIR to evaluate sample quality• Performed refrigerant extraction to quantify extractable materials that are soluble in elastomers with the working fluids of a compressor• Evaluated seal materials for signs of Rapid Gas Decompression with the working fluids of a compressor in compliance to the NORSOK M-710 / ISO 23936-2 rating system

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  Intel corporation

  Aug 2022 - now

  Ic packaging r&d engineer