Tommy Cheng

Tommy Cheng

Undergraduate Student Researcher

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location of Tommy ChengHsinchu City, Taiwan, Taiwan

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  • Timeline

  • About me

    Project Lead | Material Expert | Process Development Engineer | 3DIC advanced packaging R&D @ TSMC(HQ)

  • Education

    • National Tsing Hua University

      2014 - 2016
      Master's degree Materials Science and Engineering GPA: 4.28/4.3
    • National Central University

      2010 - 2014
      Bachelor's degree Chemical and Materials Engineering GPA: 3.91/4

      Activities and Societies: Class representative / CME Student Association event coordinator

  • Experience

    • National Synchrotron Radiation Research Center

      Jul 2013 - Aug 2013
      Undergraduate Student Researcher

      Used in-situ X-Ray diffraction to investigate the effect of light illumination for phase transformation in Poly(vinylidene fluoride-co-trifluoroethylene)/TiOPc Films

    • ADATA Technology Co., Ltd.

      Jul 2014 - Aug 2014
      Manufacturing Engineer

      Implemented the PDCA cycle to integrate IC sorting jig status monitoring into MES and BI systems, resulting in an annual cost savings of 34,970 RMB.

    • TSMC

      Nov 2016 - now

      -Managing R&D projects to drive innovation in future semiconductor solutions, with a focus on CoWoS-L, CoWoS-S, and SoW technologies.-Collaborating closely with cross-functional teams (BD, Q&R and buyers) and key external suppliers to ensure reliable process/material development aligned with TSMC’s strategic roadmap.-Mentoring a three-member team to boost productivity while ensuring strong alignment with TSMC’s core values.Hands-on process:1.Carrier bonding2.IR/UV debonding3.Vacuum lamination4.Transfer molding Show less -Spearheaded initiatives to enhance manufacturing efficiency for CoWoS-S and InFO PoP products through innovative solutions and process optimizations.-Utilized advanced analytical techniques to identify and resolve complex process-related issues. Developed and executed SOP/OCAP, leading to a reduction in defects and increased reliability of the production line.-Collaborated closely with cross-functional teams, including R&D, Q&R, and manufacturing, to ensure seamless integration of novel technologies and processes.Hands-on process:1.Edge trimming2.Mechanical Saw3.Underfilli dispensing4.SMT assembly process Show less

      • Project Lead, R&D Module Engineer

        Apr 2022 - now
      • Team Lead, Senior Process Engineer

        Jul 2021 - Apr 2022
      • Process Engineer

        Nov 2016 - Jul 2021
  • Licenses & Certifications

  • Honors & Awards

    • Awarded to Tommy Cheng
      R&D IIP Recognition Award - Aug 2024 Delivered new Si carrier automation flow in LSI Gen2b bonding process for CoWoS-L_5x, resulting in cost saving 24%.
    • Awarded to Tommy Cheng
      R&D IIP Recognition Award - Oct 2023 Developed ML-assisted model to accomplish auto defect classification on low Df Composite-PM lamination process
    • Awarded to Tommy Cheng
      R&D IIP Recognition Award - Dec 2022 Develop next generation low Df Composite-PM to future product requirement in CoWoS® packaging technology.
    • Awarded to Tommy Cheng
      TQE & Innovation Conference TSMC Jun 2018
    • Awarded to Tommy Cheng
      Scholarship of ECLAT EDUCATION FOUNDATION ECLAT Jul 2015
    • Awarded to Tommy Cheng
      Phi Tau Phi Honorary Membership The Phi Tau Phi Scholastic Honor Society of the Republic of China Jul 2014
    • Awarded to Tommy Cheng
      Scholarship of Outstanding Engineering Student Chinese Institute of Engineers Apr 2014
    • Awarded to Tommy Cheng
      Scholarship of Chemax International Corporation TASCO GROUP Dec 2013