
Tommy Cheng
Undergraduate Student Researcher

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About me
Project Lead | Material Expert | Process Development Engineer | 3DIC advanced packaging R&D @ TSMC(HQ)
Education

National Tsing Hua University
2014 - 2016Master's degree Materials Science and Engineering GPA: 4.28/4.3
National Central University
2010 - 2014Bachelor's degree Chemical and Materials Engineering GPA: 3.91/4Activities and Societies: Class representative / CME Student Association event coordinator
Experience

National Synchrotron Radiation Research Center
Jul 2013 - Aug 2013Undergraduate Student ResearcherUsed in-situ X-Ray diffraction to investigate the effect of light illumination for phase transformation in Poly(vinylidene fluoride-co-trifluoroethylene)/TiOPc Films

ADATA Technology Co., Ltd.
Jul 2014 - Aug 2014Manufacturing EngineerImplemented the PDCA cycle to integrate IC sorting jig status monitoring into MES and BI systems, resulting in an annual cost savings of 34,970 RMB.

TSMC
Nov 2016 - now-Managing R&D projects to drive innovation in future semiconductor solutions, with a focus on CoWoS-L, CoWoS-S, and SoW technologies.-Collaborating closely with cross-functional teams (BD, Q&R and buyers) and key external suppliers to ensure reliable process/material development aligned with TSMC’s strategic roadmap.-Mentoring a three-member team to boost productivity while ensuring strong alignment with TSMC’s core values.Hands-on process:1.Carrier bonding2.IR/UV debonding3.Vacuum lamination4.Transfer molding Show less -Spearheaded initiatives to enhance manufacturing efficiency for CoWoS-S and InFO PoP products through innovative solutions and process optimizations.-Utilized advanced analytical techniques to identify and resolve complex process-related issues. Developed and executed SOP/OCAP, leading to a reduction in defects and increased reliability of the production line.-Collaborated closely with cross-functional teams, including R&D, Q&R, and manufacturing, to ensure seamless integration of novel technologies and processes.Hands-on process:1.Edge trimming2.Mechanical Saw3.Underfilli dispensing4.SMT assembly process Show less
Project Lead, R&D Module Engineer
Apr 2022 - nowTeam Lead, Senior Process Engineer
Jul 2021 - Apr 2022Process Engineer
Nov 2016 - Jul 2021
Licenses & Certifications
- View certificate

Six Sigma: Green Belt
LinkedInFeb 2024
Honors & Awards
- Awarded to Tommy ChengR&D IIP Recognition Award - Aug 2024 Delivered new Si carrier automation flow in LSI Gen2b bonding process for CoWoS-L_5x, resulting in cost saving 24%.
- Awarded to Tommy ChengR&D IIP Recognition Award - Oct 2023 Developed ML-assisted model to accomplish auto defect classification on low Df Composite-PM lamination process
- Awarded to Tommy ChengR&D IIP Recognition Award - Dec 2022 Develop next generation low Df Composite-PM to future product requirement in CoWoS® packaging technology.
- Awarded to Tommy ChengTQE & Innovation Conference TSMC Jun 2018
- Awarded to Tommy ChengScholarship of ECLAT EDUCATION FOUNDATION ECLAT Jul 2015
- Awarded to Tommy ChengPhi Tau Phi Honorary Membership The Phi Tau Phi Scholastic Honor Society of the Republic of China Jul 2014
- Awarded to Tommy ChengScholarship of Outstanding Engineering Student Chinese Institute of Engineers Apr 2014
- Awarded to Tommy ChengScholarship of Chemax International Corporation TASCO GROUP Dec 2013
Languages
- enEnglish
- chChinese
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