Tan Cherylene

Experience

• 

  Osram Opto Semiconductors

  May 2004 - Jan 2010

  - Maintaining and Sustaining Process (Die attach, Plasma) 4 years assisting Process Engineer (Die attach, Wire bond & Lens mounting) in maverick lot dispositions, hands-on machines,conducting evals and compiling technical reports (EER, MSA, GRR, SPC)

  • Process Engineer

    Jul 2008 - Jan 2010

  • Technical specialist

    May 2004 - Jul 2008
• 

  OSRAM

  Jan 2011 - Oct 2021

  - Lead the assembly process team of 42 headcounts comprising of 8 exempts, 10indirect and 25 direct level- Responsible for Assembly process issues (Die attach, Wire bond, Heated BondHead, Plasma, Solder printing, Reflow) for product platform of pre-molded leadframe,ceramic, MCB, QFN & bare leadframe- Drive team towards achieving process KPI, yield, speed & cost targets- Support and close the gap between R&D new product introduction to have a smoothhandshake while ensuring teamwork- Ensuring team development growth in terms of technical and individual performance- Member of Joint Engineering Team for Die attach process for plant standardization- Global speaker for Wire Bond Capital Expenditure Procurement Team & Backendunused equipment team Show less - Responsible for die attach and optical element attach process developmentparticularly supporting consumer & mobile segment- Interconnect process development specializing in • die attach gluing• optical element attach• tooling design (Solidworks) • prototype builts• manufacturing setup • develop & define process requirements • equipment sourcing • knowledge transfer Developed:• Lens attach for OS first product (BIDOS) with VCSEL chip with diffractive optical element (Flood illuminator for mobile sensing)• Time of Flight product with micro lens array (Dedicated Mobile sensing projects)• Flash product with Fresnel lens for mobile camera• Die attach process line setup for smart watch project• Prototype customer samples for flash for mobile camera & IR sensing Show less - Maintaining and Sustaining Process (Die attach, Wire bond, Plasma, AVI)• Handle customer complaints, improvement projects, update documentations• Supporting new product phase-in & product/process change management• Support product line transfer, knowledge transfer and 2x on-site new plant start-up at Wuxi, China• Lead critical customer complaint (R9) crack package quality issue not related to responsible area involving test (taping process) with global cross-functional team from R&D, Manufacturing team and CQM from Germany, US and China• Lead and mentor 33 successful 8D project closures & published monthly newsletter for 1.5years under People Development for Exempt staff• 6 weeks delegation in Osram Regensburg for Sintering die attach project• 3 months full time project involvement in OsQAR (OS Quality Automotive Reference) for plantwide manufacturing conducting detail audits for incoming material & Assembly processes to define Firewalls indicators to strengthen quality• Introduced quick solution for panel warpage using desiccator storage for QFN panels/WIPs• Completed 1st pilot FMEA using IBS tool for wire bonding process Show less

  • Process Engineering Manager

    Nov 2019 - Oct 2021

  • Process Engineering Specialist

    Mar 2019 - Oct 2019

  • Development Engineer

    Mar 2017 - Feb 2019

  • Specialist Engineer

    Jan 2014 - Feb 2017

  • Sr Engineer

    Jan 2011 - Jan 2014