Simo Saarinen

Maintenance Technician

818 followers

Reutlingen, Baden-Württemberg, Germany

Connect with Simo Saarinen to Send Message

Connect

Connect with Simo Saarinen to Send Message

Connect

Timeline
About me
Industrialization Project Manager
Education
- Tampere University of Technology
  2011 - 2014
  Master of Science (MS) Mechanical Engineering
  Activities and Societies: Extracurricular activities: language exchange program Bachelor of Science in Mechanical engineering 2006-2010
- Renmin University of China
  2009 - 2010
  Minor subject International Business/Trade/Commerce & Mandarin Chinese
- Tampere University of Technology
  2006 - 2010
  Bachelor of Science - BS Mechanical Engineering
Experience
- Tamfelt Corp.
  May 2008 - Sept 2008
  Maintenance Technician
- KONE
  Jun 2011 - Sept 2011
  Sales Support Engineer Trainee
  Engineering trainee at the Sales department at KONE North China regional main office.My duties included meeting customers together with the sales director and/or regional sales manager to present our technical solutions and other sales work. I also did sales engineering work, designing solutions fit for unique customer specifications.
- KONE
  Jun 2012 - Aug 2012
  Global Quality Trainee
  Trainee at Global Quality department in KONE corporate main office.My responsibilities were performing different kinds of quality data analysis as well as assisting in preparing monthly quality presentations to the management.
- KONE
  Jun 2013 - Sept 2013
  Technical Specialist Trainee
  Sales Support Engineering department in KONE Industrial.My duties included providing technical support, tendering customized orders and order handling.
- KONE
  Nov 2013 - Jun 2014
  Master's Thesis Project
  Master's Thesis in Production Engineering, Escalator factory.My thesis is about developing inspection processes to support continuous improvement efforts in manufacturing.
- ABB Marine and Ports / Adecco
  Nov 2014 - Nov 2015
  Quality Engineer
  Procurement department at ABB Marine
- AT&S
  Nov 2015 - Aug 2023
  Research & Development projects about future generations of IC packaging technology and substrates for high-perfomance computing chips. Program management for lithography & plating engineering in Product Development for substrate-like-PCB's and High Density Interface PCB's. High-volume printed circuit boards (modified semiadditive PCB or substrate-like-PCB) for latest generation of mobile applications & wearables. SLP (Substrate-like-PCB) printed circuit boards for module/System-in-Package applications. Advanced Packaging - embedding components into PCBs / packaging semiconductor devices.
  - Program Manager - R&D for IC Substrates
    Aug 2022 - Aug 2023
  - Program Manager - Lithography & Plating Engineering
    Jul 2021 - Aug 2022
  - Program Manager - New Product Industrialization
    Sept 2019 - Jun 2021
  - Project Leader - New Product Industrialization
    Apr 2018 - Sept 2019
  - Process Engineer - Advanced Packaging
    Nov 2015 - Mar 2018
- Bosch Sensortec GmbH
  Sept 2023 - now
  Industrialization Project Manager
  Industrialization for inertial MEMS sensors
Licenses & Certifications
- Project Management training
  Procon Unternehmensberatung GmbH