Mike Jackson

Experience

• 

  COM DEV International

  Jun 1996 - Nov 1999

  PCB Designer

  • Placement and routing of various FR4 and ceramic based PCBs for low volume satellite products.

• 

  Teklogix

  Nov 1999 - Nov 2000

  PCB Designer

  • Placement and routing of main boards for handheld scanners.

• 

  BlackBerry

  Nov 2000 - Sept 2015

  Company-wide responsibilities:• Lead role for global PCB CAD Team for analyzing and preparing for current and future technology• Analyzed and selected key Computer Automated Design software tools for all needs of the team including Layout, stackup, impedance, DFM• Ensured team hardware kept pace with the requirements for all software tools chosen• Responsible for analyzing BlackBerry PCB technology future needs, creating our technology roadmap and preparing the team and external vendors to prepare for those needs• Significantly modified some software tools for very specific team needs and, in some cases, created tools from scratch where off the shelf applications were insufficient• Modified, created and implemented new processes as needs arose including the centralization of some specialised activities where it made sense including impedance control• Maintenance of PCB specifications for all rigid PCBs (Standard, HDI & ELIC, 2-14 layers)• Responsible for cross site, cross function and external communication of technology information, process improvements and issue resolution Show less • Solely responsible for end to end layout activities for multiple main smartphone deivce mother boards.• Feasibility, placement, routing and data export for main rigid BlackBerry handheld PCBs.• Main PCBs were 8-12 layer HDI stackups with high density small pitch BGAs, 0201 components, dual sided SMT for high volume consumer smartphone market.• Designs included impedance lines, DDR, diff pairs, 5GHz high speed, audio, power, antenna.• Interfaced with all other disciplines assigned to each product design to establish optimized compromises ensuring all design requirements were met on the mother boards before volume.• Assisted in the training and career development of several more junior PCB Designers. Show less

  • PCB Specialist - Global PCB Team Technical Lead

    Jan 2011 - Sept 2015

  • Senior PCB Designer

    Nov 2000 - Jan 2011
• 

  JXN Contracting - Independent Contractor

  Feb 2016 - Dec 2017

  PCB Specialist / PCB Designer

  • Worked on the high density motherboard of a successful wearable smart glasses product.• Completed multiple mixed signal, mixed technology layouts for several clients.• Negotiated with a PCB fabrication vendor to identify a technical solution to a critical blocking issue for a product preserving the release schedule with the higher level customer.• Provided guidance balanced in technical expertise, quality as well as cost and schedule concerns.

• 

  Teledyne DALSA

  Oct 2016 - Jun 2018

  PCB Design Specialist

  • PCB Design related activities for variety of high end machine vision related products.• Layout of mainly rigid PCBs generally 4 - 20 layers with a focus on through hole via usage.• Design for DFM, DFA, cost, reliability for multiple end use including controlled goods.• Exposure to proper power switching regulator layouts for limiting EMI and ensuring proper circuit function (Buck, Boost and SEPIC).• Experienced with layout and routing theory, strategies and implementation of high speed digital signals (10 Gbps)• Multi-SDRAM DDR4 implementation using through hole vias including constraint absorption, end to end delay verification in custom Excel tool and Hyperlynx simulation, troubleshooting and verification• Mainly focused on single release to volume design cycles. Show less

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  Microsoft

  Aug 2018 - now

  Embedded in the MS Surface PCB Design Engineering group, keenly focused on ensuring that the next generation of Surface products continue to push past expectations! Embedded in the MS Surface CAD Engineering group, keenly focused on ensuring that the next generation of Surface products continue to push past expectations! Embedded in the MS Surface CAD Engineering group, keenly focused on ensuring that the next generation of Surface products continue to push past expectations!

  • Manager, PCB Design

    Jan 2022 - now

  • Sr CAD Engineer

    Oct 2020 - Jan 2022

  • CAD Engineer II

    Aug 2018 - Oct 2020