Hemanth Kumar Cheemalamarri

Experience

• 

  Indian Institute of Technology, Hyderabad

  Jan 2016 - Jun 2021

  PhD

   Ph. D. (Jan.2016 to Jun.2021) (Electrical Engineering) at Indian Institute of Technology Hyderabad, Telangana (Joined in Jan-2016), (CGPA: 8.0/10.0).o Thesis work: Low Thermal Budget, Irreversible Vertical Bonding for High-Performance Quartz Resonator, and Inter-die Cooling Applications.

• 

  The University of Tokyo

  Jan 2020 - Mar 2020

  Short term Visiting Student under SICROP Project

   Worked as a Short-term visiting student at Dr. Mita Yoshio's Lab, University of Tokyo, from 17th Jan 2020 to 15th March 2020, under the framework of the Indo-Japanese Strategic Cooperation Research Project (SICORP), jointly financed by Japan Science and Technology (JST) and Indian Department of Science and Technology (DST).o Worked Projects: Hybrid bonding between metal, silicon, and glass.Hermetically sealed High-performance RF MEMS switch with hybrid bonding, Multilayer microfluidic stack of PMMA-PMMA bonded stack at low temperature and pressure in short time. Show less

• 

  A*STAR - Agency for Science, Technology and Research

  Jun 2021 - now

  Scientist

  Process integration towards low thermal budget wafer-level (W2W) and chip level (C2W) bonding technologies for three-dimensional Integrated circuit (3D IC) realization.o Process Integration: Technology development and project execution by including the innovations in CVD, Etch, PVD, ECP, and CMP, dicing and cleaning processes. o Bonding Process development: Low thermal budget fine pitch hybrid bonding, Fusion bonding with high interface strength, Eutectic bonding, and Low-temperature metal bonding for MEMS and Quantum applications.o Etch process development: 1:5 aspect ratio TSV with smooth scallop process development, 1:10 aspect ratio TSV development with Deep Learning algorithm, TSV bottom oxide removal for Via-Last integration scheme.Grant : PI for UIBR (Use-inspired basic research) grant obtained for the year 2023-2024, to work on fundamental study of Cu microstructure modifications for low temperature Cu/Dielectric hybrid bonding.Industry projects: PI - 1 project, PE - 5 projects for bonding process development.Publications: Various prestigious conferences(ECTC, EPTC, SSDM) and Know-how's and Patens has been submitted. Show less