Stephane Bellenger

Experience

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  STMicroelectronics

  Jun 1990 - May 2001

  Packaging Process and Industrialization Manager

  1996- 2001 : Packaging & assembly processes Manager in ST (DSG) business activities. I also acted as a Packaging Expert for DSG.1995-1996 : set-up and ramp-up full-automated new packaging lines for ST's subcontractor and ST lines. Cross-organisational management structure.1993-1994 : SCR’s, Triacs & Diac Products Manager in ST (DSG). Managing $75M billing / 300 Mp per year over 10 packages families.1992-1993 : Assembly Process Manager in a North Africa back-end location, ST (DSG). Process development Manager, automation & cost reduction program for medium power package family.1990-1991 : Project Manager for New SCRs & Triacs, ST (DSG). Development, qualification & industrialization of new products ($3.4M) Show less

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  NXP Semiconductors

  Jun 2001 - May 2009

  Build a SiP pilot line, hire and train a dedicated team for, then open advanced Packaging innovation group for NXP business in Caen location. Working on 3D packaging, Flip-Chip, UBM, Bumping, Wafer moulding so called fan-out WLP (equivalent to eWLB from Infineon, or RCP from Freescale), display on Card, Medical products.Working in MEMS packaging domain as well. Contributed in reliability enhancement for siP products at manufacturing location Project Manager within a new Market Segment Team dedicated to low cost Set-Top Boxes (STB) starting with new NXP low cost source decoder chipset « Mojo » dedicated to European DTT market, Chinese and Korean cable and satellite low cost STB market. Then, extended position to Program and Project manager within the Set-Top Box Business Unit.

  • Packaging Innovation and Assembly Pilot Line Manager

    Jan 2004 - May 2009

  • Project and programme Manager for Set top boxes

    Jun 2001 - Dec 2003
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  Murata

  Jun 2009 - Aug 2014

  Assembly and Interposer Market Segment Director, Customer support & packaging expert

  Developing Interposer and Assembly Market Segment, Managing IPDiA Customer Support activity for baseline customers list under production and ramp-up phase, Managing IPDiA Subcontractors and act as Packaging expert for my company through external conferences, market development, customer interface and internal technical program consulting.

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  Éolane

  Sept 2014 - Jan 2019

  Technical Dircetor & Microelectronics Assembly Segment Manager

  Market Development dedicated to Microelectronics Packaging SolutionMarket Analysis and DevelopmentMarket Prospection and Customer Relationship DevelopmentTechnology and Packaging Solution DevelopmentTechnology BenchmarkTechnology and Process ManagementTechnical Director in Angers Site

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  STMicroelectronics

  Jan 2019 - now

  Leading a Process team dedicated to Internal Process Improvement and monitoring for our FE, EWS, Assy and T&F activities Development of New Packages and Technologies suitable for NPI dedicated for ST Microelectronics AMG Analog Division - Team Manager for AMG

  • Process QA Manager

    Jul 2021 - now

  • NPI Assembly Technologies Development Manager

    Jan 2019 - Jul 2021