
David Wei
Product and Test Engineer

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About me
MPE Manager at Diodes Incorporated
Education

Shandong Institute of Technology University
1995 - 1999Bachelor's degree Mechanical and Electronic Engineering
Experience

Shanghai Acute Applied Technologies Inc.,
Jul 1999 - Feb 2002Product and Test EngineerDeal with line disturbances and reliability fails, develop recover plans and counter measures to prevent reoccurrences Maintain Test instruments and equipment, and downtime reduction Sustain living SOP/WI to support for process change ,new products introduction and mass production

Lite-On Semiconductor Corp.
Feb 2002 - Jan 2011Product and Test Engineering ManagerIn charge of SSEC&WMEC two factories’ product and final test process. (Rectifier, ESD Protection Device, SCR/TRAIC, Power MOSFET) Multifunctional teams building, result-oriented and execution of section roadmap to achieve section KPI goals. New tester/handler/laser marking/vision introduction with full capability to achieve the best test coverage /cost /flexibility Build-up the excellent TPE team; Bring up experts and excellent team on test software & hardware development, application supporting to satisfy customer & internal needs Customer support on field issues, customer return analysis, 8D reports and recover plans. Improve production yield, equipment downtime, WIP in debug station, test process, test time and test cost. The new and special products process feasibility study and special test process development to enhance capability and competencyNote: Promoted 4 times: Product Engineer Sr. Test Engineer Section Manager and then TPE Manager. Show less

NXP Semiconductors Guangdong Ltd.
Feb 2011 - May 2016Chief Engineer and Project ManagerHands on development of ATE test hardware and Software on small signal Discrete, ESD protection Diodes, Analog, Power IC, Logic and RF products Collaborate with multinational team on full package development cycle from project concept to mass production Work with Design, Operations, Vendors and process team to develop new packages(DFN, WLCSP, Flip Chip) to enhance company competitiveness, evaluating lead time, yield and cost performance Successfully created training strategy to coach staff s to achieve best in class engineering/technical solutions Carry on 6 sigma Black Belt projects to achieve the breakthrough improvement in productivity, yield, cost and quality Show less
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Universal Scientific Industrial (Shanghai) Co., Ltd.
May 2016 - Dec 2016Test Development ManagerUSI is a major EMS and System in Package (SIP) module manufacturing company with more than $4B in annual revenue and 10,000 employees worldwide. Reporting to SVP and building up core test development engineering team to develop and manufacture SIP module products (ET, PMIC, Wi-Fi and Bluetooth) with NI PXIe testing solution for Apple and other customers, to develop the best and efficient test solutions, also improve test operation cost and efficiency to enhance product profitability.

Diodes Incorporated
Jan 2017 - nowMPE ManagerDiodes is a leading global manufacturer and supplier of high-quality, application-specific standard products within the broad discrete, logic and analog semiconductor markets. Directly reporting to Site VP and be responsible for maverick, line disturbance, drive 8D, MRB and corrective actions. Continue improvement in yield, quality and productivity, and customer complaints and audits support activities.Note: Recognized and became a permanent employee within 2 months, 4 months ahead of the probationary period. Show less
Licenses & Certifications
- View certificate

GoLeanSixSigma.com Black Belt
GoLeanSixSigma.comApr 2018 - View certificate

GoLeanSixSigma.com Green Belt
GoLeanSixSigma.comNov 2017 
Project Management
NXP SemiconductorsMar 2012
Languages
- enEnglish
- chChinese (simplified)
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