Marlon Teves

Marlon Teves

Followers of Marlon Teves528 followers
location of Marlon TevesLapu-Lapu, Central Visayas, Philippines

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  • Timeline

  • About me

    Lean Six Sigma Black Belt | Process Engineering | Product Engineering | Licensed Electronics Engineer

  • Education

    • Easter

      2008 - 2013
      Bac Electrical, Electronics and Communications Engineering
    • Eastern Visayas State University

      2008 - 2013
      Bachelor of Science - BS Electrical, Electronics and Communications Engineering
  • Experience

    • Cebu Microelectronics Inc.

      Jan 2015 - Sept 2021

      1. Monthly proposal of process improvement for cost reduction, process time reduction and yield improvement2. Conduct education/training on data analysis to engineering group3. Implement corrective for process/product abnormalities encountered in production line4. Conduct experiment/evaluation for yield improvement and cost reduction5. Conduct Risk Analysis and Risk Assessment in production line [PFMEA]6. Initiate a meeting for product/process abnormalities encountered in production, Risk Analysis, Risk Assessment and improvement proposals7. Answers customer (internal and external) queries related to process or defective product8. Support Research and Development Team9. Making new Work Instruction, Check Sheets and Revision of other Document Show less 1. Implement corrective for process/product abnormalities encountered in production line2. Conduct experiment/evaluation for yield improvement and cost reduction3. Conduct Risk Analysis and Risk Assessment in production line [PFMEA]4. Initiate a meeting for product/process abnormalities encountered in production, Risk Analysis, Risk Assessment and improvement proposals5. Answers customer (internal and external) queries related to process or defective product6. Support Research and Development Team7. Making new Work Instruction, Check Sheets and Revision of other Document Show less > Investigation of Abnormalities 1. Analyze gathered data and conduct confirmations due to low yield 2. Confirms root cause and generate investigation report which include corrective and preventive actions 3. Finalizes investigation report through initiating meeting and discusses it to the production personnel regarding its implementation for the corrective and preventive actionsProcess Improvement 4. Conduct experimentations for cost and time reduction and to increase product yield.>Equipment and Machines Maintenance 1. Perform equipment installation and confirmation 2. Generate yearly Maintenance and Calibration plan 3. Conduct/Assist Equipment/Machine Maintenance and Calibration on its planned date 4. Create Equipment/Machine Maintenance and/or Calibration Manual Procedure 5. Conduct/assist machine/equipment Repair 6. Generate Equipment Abnormality Information 7. Conduct periodic inventory and updates of equipment consumables & Spare parts 8. Make requisition of equipment consumables and spare parts>Documentation 1. Make or revised Machine Maintenance, Calibration and Pre-operation Manual Procedure. 2. Make or revised production process documents Show less

      • Process Engineer

        Jan 2020 - Sept 2021
      • Process Engineer

        Aug 2018 - Dec 2019
      • Production Engineer

        Jan 2015 - Aug 2018
    • TAIYO YUDEN

      Sept 2021 - Jul 2022
      Production Supervisor

      • Manage manpower allocation and production output plans• Update daily production status and coordinated with cross-functional teams• Compute production capacity and generated monitoring templates using Excel

    • TECDIA CEBU, INC.

      Jul 2022 - Nov 2024

      • Lead Team for the Product Design and Development Implementation• Lead Process Engineering Team• Manage and oversee project initiatives, ensuring timely completion and adherence to project goals.• Assist in technical investigations of product abnormalities• Spearhead and lead Product Design and Development based on customer requirements• Work and collaborate with cross-functional teams to ensure project alignment and success• Conduct Lean Six Sigma Training and Workshop (Yellow Belt)• Conduct education and training on Advance Excel Data Analysis, Pivot, Formula and Graphical Representation• Conduct technical training sessions on SLC and Chip Capacitor product details, processes, and specifications. Show less

      • Assistant Manager, Process Engineering

        Dec 2023 - Nov 2024
      • Technical Development Product Engineer

        Jul 2022 - Dec 2023
    • Onsemi

      Nov 2024 - now
      Product Engineer
  • Licenses & Certifications

    • Kaizen Introduction

      Cebu Microelectronics Inc.
      Jul 2016
    • Continuous Improvement: Project Manager Of The Future

      Ask Lex PH Academy
      Jul 2024
    • Agile Scrum 101

      Ask Lex PH Academy
      Aug 2024
    • Certified Lean Six Sigma Yellow Belt

      Ask Lex PH Academy
      Jul 2024
    • Power BI Fundamentals

      DataCamp
      Jul 2024
      View certificate certificate
    • Certified Lean Six Sigma Black Belt

      ProcessDoctorsAcademy
      Aug 2024
      View certificate certificate
    • Introduction to Project Management

      Ask Lex PH Academy
      Jul 2024
    • Preditive Maintenance with MATLAB (Machine Learning)

      Institute of Electronics Engineers of the Philippines (IECEP), Inc.
      Dec 2017
    • Electronics and Communication Engineer

      Philippine Professional Regulation Commission
      Aug 2014
    • Six Sigma Statistic Using Minitab

      Quality Gurus Inc.
      Jul 2024
      View certificate certificate
  • Honors & Awards

    • Awarded to Marlon Teves
      KAIZEN Master 1st Place: Monthly Report Data Analytics Dashboard (Dynamic) TECDIA Cebu Inc Jul 2024 An Analytic Dashboard that shows data visualization on Monthly Yield, Pareto - Defect Summary, Top 3 Defects and its Defect Cost and can be used for analysis with dynamic buttons and selection
    • Awarded to Marlon Teves
      KAIZEN Master 2nd Place: Dummy Wafer Elimination for TaN Sputtering (Cost Reduction) TECDIA Cebu Inc Apr 2024 Eliminate dummy wafers waste, the dummy wafers were dispose after getting the data of Sheet Resistance. By creating calculation technique with the available data, dummy wafers won't be necessary.
    • Awarded to Marlon Teves
      Kaizen Master 2nd Place: SLC Process Flow Matrix (Automation) TECDIA Cebu Inc Apr 2024
    • Awarded to Marlon Teves
      Kaizen Mastet 1st Place: Bending Test Process Time Reduction at SWP Lapping Polishing Process Tecdia Cebu Inc Jul 2023 Process flow modification to reduce processing time
    • Awarded to Marlon Teves
      KAIZEN Master 2nd Place: SWP Polishing Auto Thickness Calculation Tecdia Cebu Inc. Oct 2022 With Auto thickness calculation, wider control limit of thickness can be applied using multiple reference chrome mask for photoresist patterning, it also aligned with capacitance tolerance design.
    • Awarded to Marlon Teves
      KAIZEN Master of Wakizashi Category - Oxygen Plasma Cleaning prior 1st Photolithography Process Cebu Microelectronics Inc., Feb 2021 This improvement is for cost reduction, replacement of chemical cleaning to Plasma cleaning.Plasma cleaning has almost same out quality result of chemical cleaning with very low cost
    • Awarded to Marlon Teves
      KAIZEN Master of Wakizashi Category- Reduction of M_AFM Defect in SK11********* Cebu Microelectronics Inc., Jan 2021 This proposal is a yield improvement. Minimizing the following defect, AFM [Adhere Foreign Materials], Enclosed Chip [EC] and Heavy Enclosed Chipping [HEC]
    • Awarded to Marlon Teves
      Certificate of Recognition for Kaizen Proposal - Restriction of mask usage with -20+20 um Dimension allowance to improved chip dimension of SK11A103******* Cebu Microelectronics Inc., Nov 2020 This proposal is to minimized chip capacitor capacitance defects by limiting the the photomask dimension in photolithography process
    • Awarded to Marlon Teves
      KAIZEN Master 1st Place - Eliminate Test Scratch for CA101K0606 and CC330K0303 Cebu Microelectronics Inc., Oct 2020 Improve the yield and the capacitance variation of CA101K0606 and CC330K0303, once the capacitance variation is minimize, NG test scratch area of the wafer can be eliminated, thus increasing the yield.
    • Awarded to Marlon Teves
      Certificate of Recognition for Kaizen Proposal - Bi-Layer Condition ind Cus-Sub with TaN-NiCr-Au fro TaN Film Over-etching improvement Cebu Microelectronics Inc. Sep 2020 Improvement resistance variation by minimizing TaN Film over-etching for resistor item. This proposal is to improvement the quality of the chips resistor by applying different method of photolithography process.
    • Awarded to Marlon Teves
      Certificate of Recognition for Kaizen Proposal - Extended Usage Frequency of Hydrogen Peroxide For Titanium Tungsten (TiW) Etching Cebu Microelectronics Inc Aug 2020 This project proposal is to extend the usage of hydrogen peroxide for TiW etching for cost reduction without affecting it output quality.
    • Awarded to Marlon Teves
      Certificate of Recognition for Kaizen Proposal - SWP Wafer Lapping and Polishing Rework Procedure Cebu Microelectronics Inc., Aug 2020 This proposal is to recover scratch defect wafers by performing rework on the Grinding(lapping) and wafer polishing
    • Awarded to Marlon Teves
      Certificate of Recognition for Kaizen Proposal - Reduction of Resist Volume for Photoresist Coating Cebu Microeletronics Inc., Jul 2020 Reduction of resist used photolithography process for cost reduction without affecting it quality
    • Awarded to Marlon Teves
      Certificate of Recognition for PIARR [Improvement] - Reduce Processing Time in SWP Resistance Prober Measurement Cebu Microelectronics Inc.,. 2018 This improvement is to reduce the processing time of the machine, thus increasing the output capacity per day
    • Awarded to Marlon Teves
      Certificate of Recognition for PIARR [Improvement] - No Sputtering Ring to Increase Output Chips Quantity and Preventive of No Au plating Abnormality Cebu Microelectronics Inc., 2018 This improvement is to increase the EQI [estimated quantity in] of chips by maximizing the wafers area for chip patterning. The method applied prevent also Au thickness out of specs in Au Plating process.