Chen Da

Experience

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  Zhejiang University

  May 2013 - Jun 2014

  Volunteer Research Assistant - Simulation & Test on Bubble Pump for Ultra Silent Refrigerator

  • Created 3D models of bubble-pump test bench with various tubing and framing in Solidworks.• Built analytical models for bubble generation performance based on boiling heat transfer and two-phase flow theory.• Acquired temperature, pressure and flow rate data via Agilent. Visualized test date and analytical prediction in Matlab.

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  Bosch Power Tools

  Dec 2013 - Apr 2014

  Trade support

  • Provided trade support for Bosch dealers & retailers. Performed ROI sales analysis based on marketing support investment.• Contributed to Bosch Power Tools 2014 dealers’ convention. Presented Bosch products on the 25th China International Hardware Fair, CIHF 2014 Shanghai.

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  Moog Inc.

  Aug 2015 - Jun 2016

  Graduate Co-developer - Automated Product Test System Designed for MOOG Components Group

  • Designed an X-Y-Z linear motion stage using MOOG actuators. Generated technical drawings for machining and 3D printing.• Calculated load condition and selected Mark-10 gauge as force sensor. Integrated force sensor onto motion stage mechanically.• Programmed BASIC code for MOOG actuators and LabVIEW code for sensor data reading and transmission over serial port.• Integrated BASIC / LabVIEW code. Created user interface in LabVIEW panel for tester ID logging and date management.• Documented project progress and present on weekly update meeting with MOOG Product Line Manager. Show less

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  Virginia Tech

  Sept 2015 - Dec 2016

  Graduate Research Assistant - Design and Evaluation of an Extensible Multi-Material SLA printer

  • Designed mechanical parts in Solidworks, generated detailed technical drawings and STL files for machining and 3D printing.• Designed and assembled an ultraviolet projection light path as lithography source. Added projection monitoring and light intensity adjustment functions in baseline light path with CCD camera, Matlab image recognition code.• Utilized Arduino to implement material switchover and cleaning process for bi-material printing.• Programmed and integrated LabVIEW / Arduino / BASIC code for print process, material delivery and actuator motion control. • Researched and found the most suitable photo-polymer. Measured Young’s modulus value of resins. Designed bi-material structures and simulated structure property using finite element method and theoretical calculation in ABAQUS and Matlab.• Conducted actual bi-material printing with PEGDA, Autodesk, Formlabs flexible resins. Tested and evaluated samples’ mechanical property. Achieved mechanically functional bi-material parts with minimum feature size of 70 microns. Show less

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  Movella

  Jan 2017 - now

  Junior Mechanical Engineer

  • Ideated, defended and was awarded budget to build a rotational rate-over-temperature test system for Gyro sensor evaluation, and the said test device will be the cornerstone in the calibration of the next generation Gyro sensor.• Using Solidworks designed mechanical fixtures to integrate core components from different manufacturer into test system and generated detailed technical drawings.• Scheduled a detailed, time-dependent execution time table and acted on non-functional requirements including coordinating for material supply through several vendors, shops and dealers.• Independently executed final assembling. Working with Gyro group members to develop software, LabVIEW, for test system. Show less

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  G&H Photonics

  May 2017 - now

  Process Engineer II

  Work in a team of Engineers interacting closely with Opto-Mechanical Product Design. Implement in-depth mechanical design, control system programming and experimental skills to improve Assembly/Fabrication efficiency of photonics components.Developed automatic production systems by integrating pneumatic actuators, custom-designed mechanical components, sensors, signal processing hardware and LabVIEW programming. Decreased manufacturing time by 50% and improved repeatability.Execution of theoretical/experimental research on various processes: Bonding; Reduction; Al/Au Wire bonding; RF systems and electronic impedance measurement/correction; packaging; grinding and polishing; thin film; vacuum systems; slicing (industrial saws). Show less