Yueh-Ling (Brian) Hsieh

Experience

• 

  ROC Army (Taiwan)

  Oct 2009 - Sept 2010

  Second Lieutenant of Missile Platoon Commander

  Air Defense Artillery (ADA), ROC Army,• Supervised the day-to-day operations of over 80 personnel, electronically monitored base perimeters on the island at front line, and be as superintendent over 6 missile sentries.• Orchestrated the maneuvres of air defense troops including medical and vehicle movements and coordinated the conflict between different representatives.

• 

  ITRI

  Oct 2010 - Jan 2011

  R&D Process Engineer Intern

  • Improved grinding process time efficiency by 15% and resolved issues during the glucose catalysis process.• Collaborated with multidisciplinary teams to optimize recipes through annealing, oxidizing, synthesizing, and sample analysis.

• 

  China Ecotek Corp (1535)

  Mar 2012 - Jul 2012

  Design Engineer

  • Led Selective Catalytic Reduction (SCR) Project execution with design team for correcting calculations on SCR usage and utilizing advanced heat flow simulation software with ITRI team.• Enhanced cross cultural communication skills by building partnerships with international customers

• 

  University of Florida

  Aug 2012 - Jul 2014

  Research Assistant

  Supervised by Dr. Fan Ren• Investigated the impact of proton and gamma irradiation on the DC performance, reliability, and thermal resistivity of AlGaN/GaN HEMTs using various characterization and metrology techniques.• Improved transistor breakdown voltage by 160% and verified reliability using the backside via method.• Conducted semiconductor device fabrication with DOE, including metal deposition, lithography, plasma etching, and packaging, while developing hands-on experiments and SOPs for SEM defect review.• Troubleshot, performed failure analysis, supported AFM, SEM, SIMS, TEM analysis techniques, and resolved difficult process engineering issues. Show less

• 

  ASML

  Jul 2014 - Jul 2018

  Key Coordinator & Field Management • Served as primary point of contact for IBM/GlobalFoundries, dominating the 14nm SOI-FinFET EBI market, replacing KLA's market share and taking over all recipe development• Led new product penetration and introduced E-beam technology across multiple nodes (14nm/22nm/32nm/45nm), achieving a 97% tool uptime, the highest record among all fabs in the Eastern US. Process Optimization & Yield Improvement• Led H2H evaluations on FD-SOI high-resolution inspection, CDU verification, and Iridium contamination analysis, where ASML outperforming AMAT, KLA, and Hitachi."• Enhanced EDRAM techniques, significantly cutting learning feedback time from months to weeks, and deploying D2D/D2DB e-beam defect inspection solutions.

  • Senior Application Engineer

    Jul 2016 - Jul 2018

  • Application Engineer

    Jul 2014 - Jul 2016
• 

  Mattson Technology

  Jul 2018 - now

  Key contributor within the Mattson Selective Etch Product line:• Contributed 100% of the division's revenue during 2024-2025 through the products and applications under responsibility.• Developed a variety of selective etch processes for Si, SiN, Ox, TiN, and W, achieving 1000:1 selectivity in Mattson's advanced product line.• Driving new products to retain/grow market share at critical inflection points for Memory, CIS, Power ICs in automotive industry, and Silicon Wafer Manufacturing.• Delivered multiple new tool qualifications, enabling on-schedule VNAND 128L ramp in China while driving continuous improvements to enhance tool performance, defect control, and cost reduction.• Early technology definition and pathfinding for Atomic layer etch (ALE), demonstrating it in VNAND industry with top 3 global players. Show less Novel Process Development:• Delivered diverse process developments using CF4, NF3, and SF6, achieving 1000:1 selectivity, smooth recess front, and uniform recess level (u<2%)• Developed an advanced selective W etch process with flat W grain etch front and profile control for Power ICs. Qualified for production, with tools introduced nationwide.• Developed a novel Si profile modification process with precise control for the CIS industry. Qualified for production, expanding to multiple countries.• Developed a competitive selective Si clean process with the lowest CoC in VNAND structure. Qualified for production, resulting in multiple repeat orders• Developed an ultra-high selective Si&TiN etch process with 1000:1 selectivity to oxide and flat etch front in DRAM structure. Qualified for production, leading to high repeat orders. Show less Global Support for New Tool Penetration:• Prototyped 3 radical-based ICP plasma etchers (Novyka I, A, AXP), defining manufacturing and engineering roadmaps for alpha and beta exits, and responsible for equipment final test procedures and Tier 2 documentation for onsite installation.• Supported global sites with new application engagement, defect/yield control, productivity investigation, and uptime improvement, resulting in multiple repeat orders.• Delivered multiple new tool qualifications, enabling on-schedule VNAND 128L ramp in China while driving continuous improvement of tool performance, defect control, and cost reduction.Productivity Improvement and Yield Control:• Delivered total solution to customer, meeting rigorous tool-to-tool matching criteria set by demo fab, and collaborated with local suppliers to ensure reliable quality.• Identified defect sources in a Dry Strip system for N5 FEOL penetration at a top 2 global logic player.Supplier Management:• Collaborated with suppliers to set up a digitized lab inventory system, optimizing efficiency while meeting performance, yield, and budget goals. Show less

  • Member of Technical Staff

    Mar 2023 - now

  • Process engineer 4

    Mar 2021 - Mar 2023

  • Senior Process Engineer

    Jul 2018 - Mar 2021