
Timeline
About me
Process Development Engineer at Intel Corporation
Education

University of cincinnati
2014 - 2021Doctor of philosophy (ph.d.) materials science and engineering 3.9/4.0Activities and Societies: American Physical Society

National institute of technology jamshedpur
2006 - 2010Bachelor of technology (honors) metallurgical & materials engineering 8.26/10.0Activities and Societies: Event Coordinator at Pravah 09’ & Technica 10’, (2009-10) – Successfully coordinated with judges and teams from all over India for the technical paper presentation event. Core Member of the Cultural & Dramatics Society, (2006-10) – Responsible for organizing cultural events throughout the year.

National university of singapore
2011 - 2013Master of science material science and engineering 3.15/5.0Activities and Societies: Project Manager - International Students Society under Graduate Student Society wing.
Experience

Ispat industries ltd
Jun 2010 - May 2011Senior operations engineer, blast furnace division● Led production operations with a primary focus on optimizing resource utilization for maximum efficiency.● Applied continuous improvement principles such as Total Productive Maintenance (TPM) across blast furnace production processes, delegating tasks to team members to support facility optimization efforts.● Monitored critical situations during abnormal conditions and emergency shutdowns, analyzed furnace parameter trends, and implemented decisive actions while ensuring effective coordination with the sinter plant, Steel Melting Shop (SMS), and other departments.● Implemented techniques and quality/safety standards to enhance operations and achieve cost savings, including the preparation of hourly charts, work instructions, and the adoption of quality standards like 5S and Kaizen.● Developed and maintained detailed process documentation, including Standard Operating Procedures (SOPs) and process flow charts, to ensure consistent operations and facilitate knowledge transfer. Show less

Central glass and ceramic research institute
May 2012 - Aug 2012Research intern● Developed a thin film coating of Silicon Carbide on Inconel Alloy using the Chemical Vapor Deposition (CVD) technique. ● Performed XRD, SEM, EDS, FTIR, Surface Roughness, and Vickers Hardness tests to thoroughly characterize the coating. ● Devised DOE to assess coating adhesion to the base material, validating effectiveness through scratch testing and SEM-EDS analysis. ● Significantly enhanced hardness, fracture toughness, and wear resistance of the base material through the deposition of thin films. Show less

University of cincinnati
Mar 2016 - May 2021● Synthesized, characterized, and analyzed high-quality homogeneous chalcogenide AsxS100-x glasses using a novel Raman profiling technique.● Reported groundbreaking discoveries in glasses for the first time, including: (i) Reversibility window – stress-free, non-aging glasses (ii) Fragility window – melt compositions yielding super-strong glasses (iii) Volumetric window – glasses exhibiting network compaction (iv) Discovery of an elusive vibrational mode of a Quasi-Tetrahedral local structure, serving as a building block to the lucrative windows, known as the Intermediate Phase.● Maintained and troubleshot lab equipment valued at $300,000 while ensuring adherence to proper Laboratory Safety principles. Show less
Doctoral Researcher
Sept 2014 - May 2021Research Mentor
Jan 2017 - Oct 2020Laboratory Safety Manager
Jan 2017 - Oct 2020Graduate Assistant
Mar 2016 - Oct 2020

Intel corporation
Oct 2020 - Mar 2021Cmp process engineer graduate intern● Set up SPC charts with optimized control limits for the Optane TD CMP process by analyzing polish time and EPD data.● Supported senior engineers in troubleshooting CMP process issues, analyzing data to identify root causes and implement corrective actions, leading to enhanced process reliability.● Collaborated with a cross-functional team to establish a defect monitoring system for the Metal CMP process, significantly enhancing yield. ● Upgraded the Automatic Process Control (APC) feedforward model, improving control over polish times in various CMP processes. ● Qualified a new chemical formulation from a supplier for application across multiple modules within the current facility.● Mentored three new interns, supported their training, and organized team-building events as the Cohort Leader for Intel interns nationwide. Show less

Intel corporation
Aug 2021 - now● Led end-to-end development and optimization of CMP processes, enabling High Volume Manufacturing (HVM) with improved wafer quality and yield.● Utilized Design of Experiments (DOE) methodologies to evaluate and optimize slurry chemistries, pad wear rates, and process pressures, resulting in improved material removal rates and reduced defectivity.● Collaborated with cross-functional teams, including process integration and equipment engineering, to drive continuous improvements and meet stringent process goals.● Developed and implemented polish recipe optimizations and End-Point Detection (EPD) algorithms on Applied Materials (AMAT) tools, leading to a yield enhancement of over 10%.● Established Statistical Process Control (SPC) methods and Process Control Systems Analysis (PCSA) to monitor process performance and mitigate risks early in the process lifecycle.● Implemented process adjustments based on Root Cause Analysis (RCA) to address deviations in etch performance, leading to enhanced process reliability and yield.● Authored and presented technical white papers to stakeholders, advocating for new process implementations that resulted in increased throughput and operational efficiency.● Maintained comprehensive process documentation, including detailed process guides, work instructions, and Response Flow Checklists (RFC) to ensure consistent and effective responses to Out of Control (OOC) conditions. ● Partnered with equipment and material suppliers to troubleshoot process challenges, enhancing overall performance and driving process innovation. ● Facilitated knowledge transfer through collaboration with Virtual Factories (VF), ensuring successful technology ramp-up to HVM across multiple sites.● Trained and mentored peers and external stakeholders on Best Known Methods (BKMs), contributing to the overall efficiency and effectiveness of day-to-day sustaining activities. Show less ● Designed and executed experiments to optimize dry etch recipes, focusing on gas flow rates, plasma power, and process durations to achieve precise etch profiles and uniformity. ● Developed and refined etch processes for advanced semiconductor nodes, improving critical dimensions and overall process stability.● Implemented Model Based Problem Solving (MBPS) techniques to conduct Failure Modes and Effects Analysis (FMEA) to mitigate risks early in the process lifecycle.● Collaborated closely with cross-functional task forces including integration and equipment teams to troubleshoot and resolve etch-related defects, reducing scrap rates and improving tool uptime.● Authored technical reports and presented findings to senior management, providing data-driven recommendations for process improvements and next-generation etch development.● Participated in daily operations and process meetings, providing insights and updates on project progress and actively contributing to problem-solving discussions Show less
CMP Process Development Engineer
Apr 2022 - nowDry Etch Process Development Engineer
Aug 2021 - Mar 2022
Licenses & Certifications
- View certificate

Lean six sigma yellow, green & black belt i go4sixsigma
UdemyMay 2020 - View certificate

Quality methods
SasJan 2020 - View certificate

Exploratory data analysis
SasJan 2020 - View certificate

Design of experiments
SasFeb 2020 - View certificate

Statistical thinking and problem solving
SasDec 2019
Honors & Awards
- Awarded to Soumendu Chakravarty, Ph.D.University Graduate Scolarship University of Cincinnati Aug 2014
- Awarded to Soumendu Chakravarty, Ph.D.First position in Technical Paper Presentation National Institute of Technology, Rourkela Mar 2009 Stood first in the Metallurgical & Materials Engineering paper presentation competition at National level inter-college technical festival - Confluence 2009, National Techno-management Fest at NIT Rourkela. Topic was “Advanced High Strength TWIP Steel for Automotive Applications” and the paper discussed about how Twinning Induced Plasticity Steel can improve car safety. The paper also dealt with the evolution of microstructure and texture of TWIP steel during cold rolling, how with the… Show more Stood first in the Metallurgical & Materials Engineering paper presentation competition at National level inter-college technical festival - Confluence 2009, National Techno-management Fest at NIT Rourkela. Topic was “Advanced High Strength TWIP Steel for Automotive Applications” and the paper discussed about how Twinning Induced Plasticity Steel can improve car safety. The paper also dealt with the evolution of microstructure and texture of TWIP steel during cold rolling, how with the increasing strain, different deformation mechanisms become active. TEM observations revealed the presence of deformation twinning at low strains (ɛ< 0.1). Volume fraction of strain was also seen to be increased. At higher strain levels, non-homogeneous deformation mechanisms such shear band formation become active. Show less
- Awarded to Soumendu Chakravarty, Ph.D.Second position in Technical Paper Presentation National Institute of Technology, Jamshedpur Mar 2008 Stood second among in Paper Presentation competition at Pravah ’08, National Techno-management Fest at NIT Jamshedpur. Topic was “Grain Refinement of Materials through ECAP (Equal Channel Angular Pressing) Process”. This paper dealt with the techniques as well as characteristics of grain refinement in materials processed by severe plastic deformation.The paper also discussed the extraordinary mechanical properties, i.e. very high strength and ductility, formability, high hardness, as well as… Show more Stood second among in Paper Presentation competition at Pravah ’08, National Techno-management Fest at NIT Jamshedpur. Topic was “Grain Refinement of Materials through ECAP (Equal Channel Angular Pressing) Process”. This paper dealt with the techniques as well as characteristics of grain refinement in materials processed by severe plastic deformation.The paper also discussed the extraordinary mechanical properties, i.e. very high strength and ductility, formability, high hardness, as well as how low temperature and high strain rate super plasticity can be observed in nanostructured metals produced by severe plastic deformation (SPD). Several SPD techniques have been proposed within which the greatest results have been obtained from Equal Channel Angular Extrusion (or Pressing), (ECAE, or ECAP). Show less
- Awarded to Soumendu Chakravarty, Ph.D.Jagadish Bose National Science Talent Scholar Jagadish Bose National Science Talent Search Dec 2004 JBNSTS Scholar for excellence in Science from North-Eastern Region of India.
Volunteer Experience
Quiz Club Organizer
Issued by University of Cincinnati on May 2016
Associated with Soumendu Chakravarty, Ph.D.Project Manager, Graduate Student Society (ISS wing)
Issued by National University of Singapore on Jan 2012
Associated with Soumendu Chakravarty, Ph.D.Event Coordinator for Pravah & Technica - Annual technical fest of NIT Jamshedpur
Issued by National Institute of Technology Jamshedpur on Jan 2009
Associated with Soumendu Chakravarty, Ph.D.Organizer - National Service Scheme (NSS)
Issued by National Institute of Technology Jamshedpur on Jan 2007
Associated with Soumendu Chakravarty, Ph.D.
Languages
- enEnglish
- hiHindi
- beBengali
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