Experience

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  Sony | r&d

  Oct 2012 - Jul 2017

  Mechanical design engineer

  Mechanical design engineer 1.Design Mechanical parts - Solid works 2.Enhance PM activity by introduce Reliability centered maintenance (RCM).3.Handle 8D for customer return issues.

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  On semiconductor

  Aug 2017 - now

  Front end equipment engineer

  I'm a Certified Lean Six Sigma Black BeltWork Description:➢ Responsible for wafer back coating, wafer mounting, wafer dicing, lead frame pre tapping, lead frame post-tapping, lead frame 2DID, lead frame mounting and package sawing Equipment and process.➢ Optimize the parameter spec for equipment and execute continuous improvement to enhance production yield and quality output.➢ Lead FMEA, Control plan, & 8D➢ responding to breakdowns and diagnosis faults.➢ Align with suppliers for any new fabrication and designing toward the quality improvement.➢ Managing stocks, budgets, and spare part inventory for equipment.➢ Manage downlines (Technician & Assistant Technician).➢ Ensuring compliance with health and safety legislation. Lead safety and quality buyoff formachine modification and new machine➢ Perform risk assessment, lot containment, and lot disposition for quality issue detected internallyand externally.➢ Drive and execute yield and cost improvement project related to source material project andsupplier risk management.➢ Prepare Purchase spec for new machine setup and qualifications.➢ Buy-off the machine specifications at vendor sites and ensure the machine spec is comply withour company requirements.➢ Setup the machine and check the product requirement upon machine arrival.➢ Support NPI team to run DOE, qualification test and optimize the standard Parameters.➢ Follow up with vendors and suppliers if there have any machine issue and get the solutions.➢ Train the manufacturing operators and technicians for any new machine introduction.➢ Perform the machine conversion and RCM.➢ Improve and maintain MTBA & OEE at good level.Achievement:1. Crack die improvement 2. DMAIC - Broken wafer improvement 3. Uneven WBC thickness improvement 4. Wafer die surface damage improvement 5. Manual Mounter with safety cutter cover 6. DMAIC – Package saw MTBA improvement 7. Package saw OEE improvement8. Automate manual process Show less