Experience

• 

  Bharath institute of science and technology

  Jun 1997 - Dec 1998

  Lecturer

  • Taught undergraduate courses in Mechanical Engineering.

• 

  Tagore engineering college

  Aug 2000 - Apr 2001

  Lecturer

  • Taught undergraduate courses in Mechanical Engineering.• Developed Dynamics Laboratory for the University.

• 

  B.s.abdur rahman university (formerly crescent engineering college)

  May 2001 - Jul 2009

  Assistant professor

  • Taught postgraduate and undergraduate courses in Mechanical Engineering.• Developed Mechatronics Laboratory for the University.

• 

  The research foundation for suny

  Aug 2010 - May 2013

  Graduate research associate (smart modular technologies)

  • Verification of footprints for new components.• Performed DFM reviews for PCBA.• Process development and implementation for new products.• Product qualifications per customer requirements.• Process development for components like 01005, 0201, and 0.4 mm pitch BGA.• DOE study for fine pitch BGA device to study printing and reliability. • Managed external labs for test requirements per JEDEC / IPC standards.• Qualification of process materials.• Qualification of suppliers – PCB, passives, mechanical components, etc.• Product transfer from prototype phase to high volume manufacturing.• Analysis of SMT process yield and defects data.• Root cause analysis for process defects.• Failure analysis for field returns (both FR4 and flex PCBs).• Dye and Pry analysis.• Worked closely with Applications and Design Engineers for new products.• Developed methodology for grouping products and assignment of reflow profile per part family.• Web-based application for reflow profile selection.• Mechanical assemblies for electronics systems.• Evaluation of stencil printers for SMT upgrade.• Preparation of technical reports, procedures, and visual aids for new products.• Develop and maintain process flow, BOM changes, labeling, and packaging of products.• Rework process development. Show less

• 

  Smart modular technologies

  May 2013 - now

  • Lead team of NPI and Manufacturing Engineers• Review of new product design files and process development• Selection, qualification of engineering materials for new products• Application of quality tools for process improvements• Process guidelines and checklists preparation for ensuring product quality• DFM reviews of new products• Technical inputs for manufacturing on a worldwide basis• Process development for thermal adhesive and die attach material for heat sink attachment• Guidance to team of Manufacturing Engineers to support DFM, production, reliability study and failure analysis• Automation solution for X-ray screening process, screw fastening and heat sink assembly process• Development of vision solutions for inspection and automation• Root cause analysis of SMT defects and yield improvement • Robotic soldering process development to support production Show less • Process development for new products• Product qualification per standards – JEDEC, IPC, ASTM, and MIL standards• Component reliability testing under accelerated test conditions• Root cause analysis of process defects and corrective action implementation• Root cause analysis of field failures and process development• Data analysis and process improvements to improve process yields• Development of technical capability to do failure analysis• Testing and qualification of Engineering materials Show less

  • NPI Engineering Manager

    May 2018 - now

  • Senior NPI Engineer

    May 2016 - Apr 2018

  • New Product Introduction Engineer

    May 2013 - Apr 2016