Experience

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  Silterra

  Jan 2008 - Apr 2009

  Technician (trainee) cmp department
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  Icmic-unikl academy sdn. bhd.

  Jan 2011 - Jan 2011

  Git intern
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  Ic microsystems

  Jan 2011 - Jan 2011

  Git trainee
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  On semiconductor

  Jul 2012 - Jan 2017

  - Managing a group of technician for all 3-Crew/2-Shift and Board Repair Center.- Equipment Ownership: 9 EG2001 Prober, 6 FET 3600 Tester, 5 EG2001 Inker, 2 Sorter, Wentworth Double Sided Prober, CAMTEK Eagle, BTC Packing, Tetronix Curve Tracer, Agilent B1505A, EG4090u Prober- Sustain and improve Equipment OEE based on manufacturing request: example study on current EG Prober PM Task and reduce PM task which does not impact to tool reliability/performance. - Implement TPM where operator need to wipe the chuck before loading new lot resulting ZERO wafer scrapped for Star Crack issue since Early Feb 2016.- FET TEST troubleshooting for wafer level probing failure- Improved and eliminate wafer scrap related to EG200x Prober: example add new daily task to measure the gap between transfer arms to wafer chuck to ensure no risk wafer hit the chuck during wafer transfer. Zero scrap since implemented in early 2016.- Manage and coordinate Equipment/Tools/Instrument Calibration (Internal Calibration/External Vendor Calibration).- Raise Purchase Requisitions for vendor services, consumables, parts, Probe Card Repairs/Rebuild.- Performing MSA (Attribute, Linearity, Bias, and GR&R to ensure Equipment fit for production.- Improved Halogen to LED conversion with same lumens level for Wafer Inspection Station and benefit zero maintenance since implemented in Q3'2016. (Halogen bulb need to have periodic maintenance changing the bulb).- Identified and performed correlation study between cable type and cable length that reduce parasitic Capacitance and improve accuracy during wafer testing using Boonton 7200 Meter and RG58 Cable- Convert Pneumatic Inking system to Electrical Inking system to improve OEE.- Raise ECN for changes required by Manufacturing or Equipment Capability from time to time- Verify and analyze probe data retrieval from DATAPOWER using JMP tools. Tunjukkan kurang Improving the current Device performance and reduce failures count.Working with Process Team to solve any process related failure (Furnace, Oxide thickness, Etch Rate)Works closely to find any possible root cause of failure happen (FA)Device owner for Clipper (Double Sided Wafer technology), Bipolar Photo Glass.Member of 5S team as a Bay Leader in Fab.Qualifying other sources of starting material (new epi variation from different Substrate Supplier) to match with current productivity performance.Perform Stability study by running DOE for a Bipolar Power Device in terms of electrical performance comparing Wafer Probe test with after Assembly Final Test. - improve over rejection.Optimized Semiconductor Physics knowledge each every time failure occurs and making improvement to reduce the failure counts through 8D, Problem solving skills + FMEA.Expert in using JMP tools. Tunjukkan kurang

  • Equipment Engineer Probe

    Jun 2015 - Jan 2017

  • Device Engineer

    Jul 2012 - Jun 2015
• 

  Sandisk®

  Sept 2017 - Jul 2018

  Sr equipment engineer (kgd)

  Pioneer KGD Startup Team to setup and sustain KGD In WesternDigital_Sandisk.Managing planning on setup timeline and oversee challenges to meet goal. Identify oppurtunity and improve issue raise during start up.

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  Silterra malaysia sdn. bhd.

  Sept 2018 - Jan 2020

  Sr engineer fab integration ii (e-test)
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  Everspin technologies

  Jun 2019 - Jun 2019

  Product yield engineer

  On Job Training for MRAM Technology transfer to Silterra. Training about Toggle Product, Yield analysis for Class Probe and EWS Data.

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  Ase group global

  Jan 2020 - Apr 2021

  Staff engineer
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  Intel corporation

  Apr 2021 - Jan 2023

  Mfg operation manager tsg

  People Management, Technical Support.

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  Dominant opto technologies sdn bhd

  Jan 2023 - Sept 2023

  Test engineering manager