
Timeline
About me
Electronic Development Engineer
Education

Technical university of denmark (dtu)
2000 - 2004Bachelor of science (bsc) electrical and electronics engineering (ee) grade point average: 9.4
Experience

Capres a/s
Jan 2005 - Mar 2017Electronic development engineerResponsibilities with the semi and full-automated tools from a to z: Development: Design of hardware and firmware, economic evaluation, optimization, simulating, layout and testing of electronics. In addition, develop, test, and optimize the performance of the completed semi and full-automated tools.Documentation: Schematic/layout of the electronic, and Schematic of the electronic modules, BOM list (Bill of materials), production and test instructions. Production: In house production. Outsourcing to Danish sub-supplier, EMS (Electronics manufacturing services), to make electronic modules for the tools. In addition, outsourcing to USA sub-supplier to build the semi and full-automated tools. Continuing service to sub-suppliers to optimize production. Cooperation with different departments: software, mechanical, service, physics, application and sale, to optimize the customer’s tools usage.Results:MicroRSP-A300: Full-automatic, micro scale resistivity measurements of 300 mm wafers, for semiconductor industry.CIPTech-M300: Half-automatic, micro scale, measures Magneto-resistance and Tunnelling Resistance (MR and RA) directly on blanket Magnetic Tunnel Junction (MTJ) for semiconductor industry and universities.MicroHALL-A300: Full-automatic, micro scale, Hall mobility, active carrier density, measurements of 300 mm wafers for semiconductor industry.MicroHALL-M300: Half-automatic version for semiconductor industry and universities.M4PP SEM Module: micro- and nanoscale conductivity measurements on a wide range of materials and devices in a Scanning Electron Microscope (SEM) or Focused Ion Beam (FIB).Thick and thin metal film module to full-automatic A300 tool: From micrometres to angstroms metal film layer. E.g. 5 angstroms gives a few atoms thin metal film layer, doped on a wafer.Scientific papers, co-author, in cooperation with DTU. Show less

Danisense a/s
Apr 2017 - nowR&d engineerDevelopment with high accuracy current transducers.
Licenses & Certifications
- View certificate

Prince2
Apm groupJul 2010
Languages
- daDanish
- enEnglish
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